Nidec at SEMICON INDIA 2026

Nidec Advance Technology Corporation presented inspection architectures and testing systems engineered for semiconductor production and automotive drivetrain validation. The technical portfolio addresses fabrication challenges across microelectronic manufacturing and e-mobility product verification.

Microelectronic Package Inspection Architecture
Semiconductor manufacturing yields depend heavily on defect detection across layered substrates, bare dies, and bonded packages. To resolve contact and imaging constraints, optical verification is coupled with electrical probing mechanisms.

Wafer inspection fixtures, including specialized probe cards, establish physical and electrical contact with microscale contact points on unprocessed silicon. These units operate in tandem with optical inspection platforms, such as the RWi-300MK3 system, which uses two-dimensional and three-dimensional metrology to assess wafer bump geometry and planarity. For high-density printed circuits and substrate testing, the RSH and STAR REC systems apply multidimensional optical scanning to detect shorts, opens, and trace irregularities across telecommunications, server, and automotive computing hardware.

Downstream package integrity is evaluated using automatic inspection equipment from the GATS series, alongside the NATS platform configured for power semiconductor switching components. Defect classification across these inspection stages incorporates three-dimensional automated fast visual inspection (AFVI) via AI algorithms embedded within the AURCA system, reducing false alarm rates in high-throughput production lines.

E-Mobility Test Benches and Modeling Systems
Complementing microelectronics verification, the TDAS series test benches provide mechanical and electrical evaluation for high-voltage motors and integrated electric drive axles (E-Axles). Durability and performance profiles require controlled torque, load dynamics, and thermal stress monitoring to qualify traction components under real-world operating loads before vehicle assembly.

Physical bench testing is integrated with simulation workflows using the E-Transport Simulator software package. This tool models complete electric vehicle powertrain architectures, allowing engineers to analyze electromagnetic parameters, thermal loads, and energy efficiency digitally. Validating design variants numerically before hardware fabrication reduces bench test hours and shortens validation cycles for automotive sub-assemblies.

Industrial Implementation and Event Presentation
The operational capabilities of these combined measurement and testing platforms were presented during SEMICON India 2026, held from September 17 to September 19, 2026, at the Yashobhoomi India International Convention & Expo Centre in New Delhi. The technical display showcased hardware setups and software interfaces designed to integrate directly into active cleanroom environments and automated automotive assembly facilities.

Edited by Evgeny Churilov, Induportals Media - Adapted by AI.

www.nidec.com