Infineon News

New i-ToF imager enables smallest 3D camera systems with improved quantum efficiency at optimized cost

Infineon Technologies AG, in collaboration with 3D time-of-flight specialist and premium partner pmdtechnologies, introduces the IRS2976C Time of Flight (ToF) VGA sensor, a performance-enhancing evolution of the IRS2877C ToF VGA sensor and novel member of the REAL3 product family.

Rohde & Schwarz

Embedded world 2023: Rohde & Schwarz showcases its state-of-the-art test solutions for embedded systems

Embedded systems are at the core of today’s electronic devices, whether in consumer electronics, telecommunications, industrial, medical, automotive or aerospace applications. Flawless operation is crucial, and engineers face complex challenges when designing ever more compact embedded systems which meet today’s demands of efficiency, safety, reliability and interoperability. Rohde & Schwarz addresses these challenges with its wide-ranging test and measurement solutions showcased at the embedded world Exhibition & Conference 2023 in Nuremberg.

Rohde & Schwarz

Rohde & Schwarz collaborates with Qualcomm and Iridium Communications to test Snapdragon Satellite

Qualcomm Technologies Inc., Iridium Communications Inc. and Rohde & Schwarz recently collaborated on testing and validating Snapdragon® Satellite, a solution from Qualcomm Technologies for satellite-based connectivity on next-generation Android smartphones.

Wabtec Info

WABTEC DELIVERS THE 500TH EVOLUTION SERIES LOCOMOTIVE TO INDIAN RAILWAYS

The celebration at Wabtec's plant in Marhowra, Bihar marked another milestone in the 'Make in India' program to develop and supply 1,000 fuel-efficient, emission-compliant diesel-electric Evolution Series locomotives.

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